Mezzanine Standard VITA 93 QMC has Broad Reach for All Industries
The VITA 93.0 QMC standard, a game-changer in the realm of small form factor (SFF) mezzanines for rugged computing, is making waves in various advanced technology sectors beyond military and avionics. This standard, designed with reliability and ruggedness in mind, offers a versatile solution for industries requiring compact, high-density, and high-performance computing modules.
The VITA 93.0 QMC standard caters to a wide array of non-military and avionics uses. These include industrial automation systems, where embedded computing modules must fit into small spatial footprints while operating reliably in harsh conditions. Telecommunications infrastructure, including 5G and 6G networks, also benefits from high-density, high-speed connectors and embedded systems compliant with standards like VITA 93.0 QMC.
Test and measurement equipment, phased array antenna systems in non-military radar or communication applications, and emerging fields such as quantum computing and artificial intelligence are other areas that can leverage the advantages of VITA 93.0 QMC. These industries demand miniaturized, rugged computing platforms that conform to new standards.
Industrial and avionics requirements for electrical reliability and safety are reflected in the electrical safety standards (like UL and CE specs related to creepage and clearance distances) addressed by the VITA 93.0 QMC standard.
The QMC connectors, designed to handle high-speed signals such as PCI Express Gen 5, are a key feature of the standard. The cost for these connectors is a small part of a solution, making them economically viable compared to military and avionics versions. The QMC approach provides more bandwidth as each slot has a set of connectors.
The VITA 93.0 QMC standard addresses applications that use Mini-PCIe modules and provides variable stacking specifications, unlike most mezzanine standards. Thermal interface material is provided by the carrier manufacturer in QMC cards, and these cards can be air-cooled or conduction-cooled.
The standards provide support for high-performance FPGAs, GPUs, and AI/ML accelerators as well as storage. The mechanical envelope definitions are tight in QMC to maximize interchangeability and reliability. The pair of connectors in QMC includes a PCIe side and a general I/O connection for high-speed serial communication.
The VITA 93.0 QMC standard, comparable to the M.2 standard, offers higher-speed, rugged connectors and better scalability. The detailed report for the standard was made available in 2023, with the various standards associated with VITA 93 still in the finalization stage.
In conclusion, the VITA 93.0 QMC standard, initially designed for rugged computing in avionics and military, is proving to be a valuable asset across numerous industries. Its form factor, connector technologies, and ruggedness make it ideal for demanding industrial, telecommunications, scientific, and avionics sectors where miniaturization, density, ruggedness, and reliability are crucial. VITA 93.0 QMC modules will work well in environments beyond military and avionics, such as industrial vehicles and commercial drones.
Data-and-cloud-computing sectors have the potential to greatly benefit from the versatile and high-density features of VITA 93.0 QMC technologies, particularly in areas that require miniaturized, rugged computing platforms for big data processing and cloud services. The technology adheres to electrical safety standards and offers economically viable high-speed connectors.
In the realm of telecommunications and internet infrastructure, the compatibility of VITA 93.0 QMC with 5G and 6G networks, as well as its high-density, high-speed connectors, positions it as a promising solution for the expanding network demands.
