Presentation: Unveiling VITA 93 Quantum Machine Code
In the world of mezzanine card technology, a new standard is making waves. VITA 93 QMC, a compact and rugged mezzanine card standard, is designed for industrial, military, commercial, and avionic applications, offering improved modularity, high-density I/O, and compatibility with rugged systems.
Scheduled for July 1, 2025, at 1:00 PM ET / 12:00 PM CT / 10:00 AM PT / 6:00 PM GMT, a webinar on this exciting new standard will provide valuable insights into its features and architecture. The free event, hosted by Bill Wong, Senior Content Director at Electronic Design, will feature panelists such as Jan Zimmerman, General Manager at TEWS Technologies, and Mark Littlefield, Senior Manager of Embedded Computing at Elma Electronics.
TEWS Technologies, renowned for providing I/O solutions of the highest quality, has already released the first QMC modules and PCIe carrier cards compliant with VITA 93. This move signifies the standard's role in advancing mezzanine card technology for demanding applications.
VITA 93 QMC defines a compact, quarter-size mezzanine card for embedded systems, supporting advanced high-speed I/O including PCI Express lanes, optimized for robust signal integrity. It also enables modular embedded solutions, facilitating the development of modular CPU and I/O expansion boards, simplifying system upgrades and maintenance. Moreover, it's designed to interface with carrier cards to extend flexibility in system design.
The standard's significance is evident in various applications. For instance, in industrial and commercial settings, it provides a ruggedized and standardized computing module solution conducive to reliable operation in harsh industrial environments, improving system modularity and maintenance. In military applications, it meets military-grade reliability and durability requirements, enabling embedded computing in mission-critical defense equipment.
For avionic applications, VITA 93 QMC supports the demanding environmental and performance standards required in aerospace systems, including compliance with MIL-STD standards. In the realm of embedded computing, it offers a compact and scalable platform for integrating high-performance processing and I/O expansion modules, crucial for advanced radar, signal processing, and networking systems in these sectors.
Matthew Burns, Director of Technical Marketing at Samtec, brings over 25 years of experience in design, applications engineering, technical sales, and marketing in the telecommunications, medical, and electronic components industries. He will be sharing his insights during the webinar, developing go-to-market strategies for Samtec's Silicon-to-Silicon solutions.
While neither Jan Zimmerman nor Matthew Burns are directly associated with the webinar or active contributors to VITA or SOSA technical working groups, their expertise and experience in the industry will undoubtedly enrich the discussion. Jan Zimmerman, General Manager at TEWS Technologies, holds a Master's degree in business engineering from the Nordakademie in Hamburg (Germany). Matthew Burns has a B.S. in Electrical Engineering from Penn State University and a Masters in Computer Science from Rutgers University.
The webinar can be accessed by signing up or logging in. Don't miss this opportunity to learn more about the groundbreaking VITA 93 QMC standard and its implications for the future of mezzanine card technology.
The webinar on July 1, 2025, will delve into the implications of the VITA 93 QMC standard, particularly its role in data-and-cloud-computing technology through advanced high-speed I/O and modular embedded solutions. Panelists such as Jan Zimmerman and Matthew Burns will share their insights and experiences relevant to the application of this standard.
TEWS Technologies, in collaboration with other industry experts, has been instrumental in developing technology-centered solutions compliant with VITA 93 QMC, further emphasizing its potential impact on mezzanine card technology.
